“We expect to see earlier design commitments emerge beginning in 2026 and expanding into 2027.”

In context

“will be a long journey for us. We have made steady progress with Intel 4 and Intel 3, and 18A wafers are now running ahead of internal projections, representing a meaningful inflection in our execution and our factory finished-good output. We also continue to make steady progress on our advanced packaging technologies, including additional growth in customer backlog in the quarter. On Intel 18AP and Intel 14A, we continue to be encouraged by our external engagements. Intel 14A maturity, yield, and performance are outpacing Intel 18A at a similar point in time, and we continue to develop PDKs with multiple customers actively evaluating the technology. Their partnership has been critical, and their feedback is continuing to help us define the technology so that we can cater to their needs. We expect to see earlier design commitments emerge beginning in 2026 and expanding into 2027. I am particularly pleased that our progress to date has driven us to land more of our own future product tape-outs on Intel 14A as well. At a time when advanced wafer capacity is in short supply, this enables us to have better control over our supply chain. Intel has pioneered nearly every major innovation that has enabled dimensional scaling and high-volume manufacturing of silicon transistors over the last six decades. We have always been willing to take measured risks that have eventually paved the way for step-function improvements in transistor density, cost, power, and performance. As we look to continue challenging the status quo, I can think of no better partner than Elon Musk. We recently announced our partnership with SpaceX, xAI, and Tesla to support TeraFab. Elon and I share a”