“Looking ahead, our data center AI business is entering its next phase of growth with customer momentum building rapidly ahead of the launch of our next-gen MI400 Series accelerators and Helios rack-scale solutions in 2026.”

In context

“.AI and Luma AI, are now running production workloads on MI300 Series demonstrating the performance and TCO advantages of our architecture for real-time AI applications. We also made significant progress on the software front in the quarter. We launched ROCm 7, our most advanced and feature-rich release to date, delivering up to 4.6x higher inference and 3x higher training performance compared to ROCm 6. ROCm 7 also introduces seamless distributed inference, enhanced code portability across hardware and new enterprise tools that simplify the deployment and management of Instinct solutions. Importantly, our open software strategy is resonating with developers. Hugging Face, vLLM, SGLang and others contributed directly to ROCm 7 as we make ROCm the open platform for AI development at scale. Looking ahead, our data center AI business is entering its next phase of growth with customer momentum building rapidly ahead of the launch of our next-gen MI400 Series accelerators and Helios rack-scale solutions in 2026. The MI400 Series combines a new compute engine with industry-leading memory capacity and advanced networking capabilities to deliver a major leap in performance for the most demanding AI training and inference workloads. The MI400 Series brings together our silicon, software and systems expertise to power Helios, our rack-scale AI platform designed to redefine performance and efficiency at data center scale. Helios integrates our Instinct MI400 Series GPUs, Venice EPYC CPUs and Pensando NICs in a double-wide rack solution optimized for the performance, power, cooling and serviceability required for the next generation of AI infrastructure and supports Meta's new open rack wide standard. Development of both our MI400 Series GPUs and Helios rack is progressing rapidly, supported by deep tec”