“So take it that we expect revenue a minimum revenue, one way to look at it, of $73 billion over the next six quarters. But we do expect much more as more orders come in.”

In context

“trong and growing backlog, right, the question is does the team have three nanometer, two nanometer wafer supply, COA substrate, HBM supply commitments to support all of the demand in your order book and I know one of the areas where you are trying to mitigate this is in advanced packaging. Right? You're bringing up your Singapore facility. You guys just remind us what part of the advanced packaging process the team is focusing on with the Singapore facility? Thanks. Hock Tan: Thanks. Well, to answer your first simpler question, you're right. You can say that $73 billion is the backlog we have today. To ship over the next six quarters. You might also say that and given our lead time, we expect more orders to be able to be absorbed into our backlog for shipments over the next six quarters. So take it that we expect revenue a minimum revenue, one way to look at it, of $73 billion over the next six quarters. But we do expect much more as more orders come in. For shipments within the next six quarters. Yeah. Our lead time depending on the particular product it is, can be anywhere from six months to a year. On with respect to supply chain is what you're asking critical supply chain on silicon. Yeah. And packaging. Yeah. That's an interesting challenge that we have been addressing over for constantly and continue to. And with the strength of the demand and the need for more innovative packaging, advanced packaging, because you are talking about multi chips multi multi chips in creating every customer accelerator now. The packaging becomes a very interesting and technical challenge. And building our Singapore fab is to really talk about partially insourcing those advanced packaging. We believe that we have enough demand we can literally insource”