“We will now be taping out our next generation 200-terabit switch this quarter.”

In context

“igawatt, which includes XPUs and our networking has been received and will start delivery in the second half of 2027. For our other 2 customers, we expect shipments to begin late 2026 and accelerate into 2027. To date, we have received purchase orders totaling $6 billion. While we have significant IP, and execution leadership in XPUs, Networking is key to building scalable XPU and GPU clusters. And here, in networking, we have at least 1 generation of technology and product leadership. For scale up within racks, enable direct-attach copper based on an industry-leading 200G and 400G SerDes. Driving co packaged copper with Ethernet and PC Express switches. For scale out between the racks, We have been shipping the industry's only 100-terabit Ethernet switch, the Tomahawk 6, for over a year. We will now be taping out our next generation 200-terabit switch this quarter. And in CPOs, which is co-packaged optics, 1.6-terabit DSPs, CW and EML lasers, We are the de facto standard in the industry. To extend AI clusters across data centers, We remain the industry leader with our Jericho 3 and Jericho 4 fabric solutions. And enabling the world's largest deployments of multiple hyperscalers. Our strategic vision is to bring together Broadcom's leading technology and investor partners with the strongest balance sheets to deliver at scale sufficient compute capacity at the lowest cost and power for the leading AI frontier labs. Including entropic and OpenAI. To deliver this vision, we are creating the AI XPU platform. With Apollo and Blackstone and other leading investors to deploy more than 20 gigawatts of compute capacity through 2020. The first trench of this p”